Conductive Materials
Conductive Materials
Conductive materials play a critical role in electronic devices, conductive composites, and electromagnetic shielding systems by delivering superior conductivity and dispersion.
Product Series
Copper Superconducting Wire
High-performance copper-based conductive fillers with ultra-high conductivity and excellent oxidation resistance, suitable for conductive adhesives, conductive coatings, and electromagnetic shielding materials.
Key Features
- Volume resistivity ≤10^-7 Ω·cm
- Superior antioxidant performance
- Excellent dispersibility
Technical Specifications
Super Copper-Based
A copper-based composite conductive material, modified through specialized processes, delivers excellent electrical and thermal conductivity along with superior mechanical properties. Ideal for electronic packaging and thermal management applications.
Key Features
- Excellent electrical and thermal conductivity
- Good mechanical strength
- Excellent machinability
Technical Specifications
Super Copper Powder
High-purity ultrafine copper powder with uniform particle size distribution and excellent dispersibility, suitable for conductive pastes, 3D printing materials, and metal injection molding.
Key Features
- Purity ≥ 99.9%
- Uniform particle size distribution
- Excellent dispersibility
Technical Specifications
Silver-coated copper powder
Silver-coated copper powder composite conductive filler, combining silver's superior conductivity with copper's cost advantage, ideal for high-end conductive adhesives and electronic pastes.
Key Features
- Excellent conductivity
- Strong antioxidant performance
- Costs less than silver powder
Technical Specifications
Shielding material
Electromagnetic shielding material with superior electromagnetic wave absorption and reflection properties, designed for EMI protection in electronic devices, communication equipment, and military systems.
Key Features
- High electromagnetic shielding effectiveness
- Broadband Shielding Performance
- Lightweight and High-Strength
Technical Specifications
Diamond-Copper Thermal Interface Material
Diamond-coated copper composite thermal material, combining diamond's ultra-high thermal conductivity with copper's excellent electrical conductivity, is ideal for high-power electronic devices and LED heat dissipation applications.
Key Features
- Ultra-high thermal conductivity
- Excellent conductivity
- low coefficient of thermal expansion
Technical Specifications
copper superconducting wire
High-performance copper-based conductive fillers with ultra-high conductivity and excellent oxidation resistance, suitable for conductive adhesives, conductive coatings, and electromagnetic shielding materials.
Key Features
Volume resistivity ≤10^-7 Ω·cm
Superior antioxidant performance
Good dispersibility
High purity, low impurities
Technical Specifications
Super Copper-Based
A copper-based composite conductive material, modified via specialized processes, delivers exceptional electrical and thermal conductivity alongside superior mechanical properties, making it ideal for electronic packaging and thermal management applications.
Key Features
Excellent electrical and thermal conductivity
Good mechanical strength
Excellent machinability
Cost-effective
Technical Specifications
Super Copper Powder
High-purity ultrafine copper powder with uniform particle size distribution and excellent dispersibility, suitable for conductive pastes, 3D printing materials, and metal injection molding.
Key Features
Purity ≥ 99.9%
Uniform particle size distribution
Excellent dispersibility
High liquidity
Technical Specifications
Silver-coated copper powder
Silver-coated copper powder composite conductive filler, combining silver's superior conductivity with copper's cost advantages for high-end conductive adhesives and electronic pastes.
Key Features
Superior conductivity
Strong antioxidant performance
Costs less than silver powder
Excellent compatibility with resins
Technical Specifications
Shielding material
Electromagnetic shielding material with superior electromagnetic wave absorption and reflection performance, designed for EMC protection in electronic devices, communication equipment, and military systems.
Key Features
High electromagnetic shielding effectiveness
Broadband Shielding Performance
Lightweight and High-Strength
Excellent corrosion and weather resistance
Technical Specifications
Diamond-Copper Thermal Interface Material
Diamond-coated copper composite thermal material, combining diamond's ultra-high thermal conductivity with copper's excellent electrical conductivity, is ideal for high-power electronic devices and LED heat dissipation applications.
Key Features
Ultra-high thermal conductivity
Superior conductivity
Low Coefficient of Thermal Expansion
Excellent high-temperature stability
Technical Specifications
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